dicing

英 [ˈdaɪsɪŋ]

美 [ˈdaɪsɪŋ]

v.  将(肉、菜等)切成小方块; 将…切成丁
dice的现在分词

计算机

柯林斯词典

• 骰子;色子
  Adiceis a small cube which has between one and six spots or numbers on its sides, and which is used in games to provide random numbers. In old-fashioned English, 'dice' was used only as a plural form, and the singular wasdie, but now 'dice' is used as both the singular and the plural form.
• 掷骰子游戏
  Diceis a game which is played using dice.
• VERB 把(食物)切成小块;将…切丁
  If youdicefood, you cut it into small cubes.
  1. Dice the onion...
     把洋葱切成丁。
  2. Add the crushed garlic and remaining diced vegetables.
     加入捣碎的大蒜和剩余的蔬菜丁。

双语例句

• Performance analysis and three-dimensional modeling of wafer dicing with diamond blade
  金刚石砂轮刀片划切过程性能分析与三维建模
• The Technology Study on UV Laser Dicing High Brightness LED Wafer
  高亮度LED晶圆紫外激光划片技术研究
• Some have questioned whether the dicing up of mortgages added any value to the economy.
  有人质疑，将按揭贷款分割出售究竟给市场经济增加了什么价值。
• In this paper, part of theoretical and experimental studies on the application of UV laser in dicing of sapphire wafer and SiC were presented.
  本论文对紫外激光应用于蓝宝石晶圆和碳化硅等材料的划切加工技术进行了部分理论与试验研究工作。
• Our process training would cover variety of topics from choosing the right blades to setting an appropriate dicing process for various materials and applications.
  我们的工艺培训可以涵盖不同的主题，包括面对不同材料和应用该如何选择合适的刀片到设置适当的工艺参数等。
• Design and Realization of CAN node for Full Automatic Dicing Saw
  全自动划片机中CAN总线节点设计与实现
• After an analysis of the process of semiconductor fabrication, a proposal of the wafer dicing using micro-abrasive waterjet is put forward.
  通过对半导体加工工艺的分析研究，提出了用磨料水射流切割半导体材料，包括晶圆的切割、芯片的终端封装切割。
• Upon the installation of a multi beam laser dicing system, the obviously advantages of using such a laser dicing process become evident.
  基于已经安装的多光束激光划片系统，其显著的优点已经得到证实。
• Alphablox provides drill-down and slicing and dicing capabilities that can answer the types of business questions that we asked earlier.
  Alphablox提供向下钻取和细分功能，以回答我们先前提出的业务问题。
• In OLAP processing, slicing and dicing is often performed along a time axis to analyze trends and find time-based patterns in the data.
  在OLAP的加工，切片和切割往往是演出沿着时间轴来分析发展趋势，并抽出时间为基础的模式中的数据。